ISSN 1556-6757




Volume 4, Issue 1, 2013


Optimization of vertical links in a three-dimensional NOC based multicore crypto processor for cloud computing.  A.Vino Vilmet Rose and R. Seshasayanan

The popularity of multiprocessors over the last few years has been made possible by network on chip (NoC). The advent of Three-Dimensional Network on Chip (3D NoC) has facilitated the communication in three dimensional integrated circuits (3D IC). However, the implementation of 3D NoC is a vital issue with the fabrication of Through Silicon via (TSV), due to its effects on chip yield and area occupied. Hence, this work focuses on the reduction of TSV. The optimum number of TSV results in an improved yield with reduced TSV area. This work deals with solving two optimization problems. Initially, the optimum number of three-dimensional (3D) routers for a given 3D mesh NoC is obtained, followed by the determination of best possible arrangements and grouping of the 3D routers, so that the throughput is maximized. The optimization problem is solved using Ant Colony Optimization (ACO) and Simulated Annealing (SA), and their results are compared. It is then applied for the design of 3D NoC based multicore crypto processor design for cloud computing applications. It should be noted that there is an improvement in the execution times for the RC6 and AES algorithms for varying key sizes with and without NoC . The benchmark application AES256 shows an improvement of 49% with NoC and RC6128 is close by 44.7% .The throughput improvement is 52% for RC6 and Blowfish by 48%. Full Article